| 摘要 |
<p>First (46) and second (62, 63) bumps electrically connected at first and second positions along a conductive run (52) borne by a flexible substrate (10) are respectively oriented for contact with a pad (8) of a die under test (2) and a pad (88, 89) of a tester. A probe frame (32) is bonded to the substrate between connector frames (34) bonded at opposite ends of the substrate (10). Alternatively, a pair of bumps (46, and 62, 63) exposed on the same surface of a flexible substrate (10) are electrically connected at different positions along on conductive run (52). One of the bumps (46) is oriented for contact with a pad (8) of a die under test (2), and the other (62, 63) is in contact with a pad (88, 89) on a surface of a printed circuit board (5) directed away from the die (2). The pad (88, 89) of the printed circuit board (5) is provided for electrical connection to a tester.</p> |
