发明名称 COMPOUND SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
摘要 PURPOSE:To reduce a dislocation density in a compound semiconductor layer by a method wherein the thickness of a second compound semiconductor layer is set at a value within a specific range and the lattice constant of the second compound semiconductor layer is set at a range which satisfies a relational expression in which the lattice constant of a first compound semiconductor layer and the lattice constant of the second semiconductor layer are used as parameters. CONSTITUTION:A second compound semiconductor layer 3 is formed on a first compound semiconductor layer 2. The second compound semiconductor layer 3 is formed in a thickness of 400 to 1400Angstrom . In this case, the second compound semiconductor layer 3 is formed in such a way that its lattice constant becomes 3<=1 (a- b)/a1X10<3=10 [where (a) represents the lattice constant of the first compound semiconductor layer and (b) represents the lattice constant of the second compound semiconductor layer]. Then, a third compound semiconductor layer 4 is formed on the second compound semiconductor layer 3.
申请公布号 JPH0817729(A) 申请公布日期 1996.01.19
申请号 JP19940146077 申请日期 1994.06.28
申请人 KYOCERA CORP 发明人 WATANABE AKIRA
分类号 H01L21/20;H01L21/205;H01L33/30;H01L33/34 主分类号 H01L21/20
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