发明名称 MACHINE AND METHOD FOR APPLYING SOLDER PASTE TO ELECTRONIC DEVICES
摘要 <p>A machine and method are provided for applying a solder paste to a solar cell or other semiconductor device. The machine comprises (1) a conveyor means (28) having at least one cell-holding means (36A, 36B) for holding a photovoltaic solar cell, (2) drive means (30) for moving the conveyor means stepwise so as to shift said cell-holding means in turn from a first cell loading position to a second cell pasting position and then to a cell unloading position, (3) selectively operable solder paste dispensing means (72, 74) for applying solder paste to a cell located at said second cell pasting position, (4) means for selectively operating said drive means and said paste dispensing means so as to (a) convey a cell from said loading position to said cell pasting position, (b) cause said paste-dispensing means to dispense solder paste onto a cell in said cell pasting position, and (c) convey the cell with the dispensed solder paste from said cell pasting position to said cell unloading position. Preferably, but not necessarily, the machine comprises two paste dispensing assemblies disposed so that solder paste may be dispensed simultaneously onto the front and back sides of a solar cell.</p>
申请公布号 WO1995021462(A1) 申请公布日期 1995.08.10
申请号 US1995001292 申请日期 1995.02.02
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