APPARATUS FOR INTERLAYER PLANARIZATION OF SEMICONDUCTOR MATERIAL.

摘要

Polishing apparatus for planarizing the macroscopically flat surface of a semiconductor material to expose microscopic features which have been formed in the semiconductor material and are below and covered by the macroscopically flat surface of the semiconductor material. The apparatus planarizes the surface of the semiconductor material to within about 100 to 250 Angstroms deviation from the perfectly flat median reference plane of the surface.