Method for producing structures which can be soldered in order to make contact with electrical modules

摘要

The invention relates to a method for producing metal structures which can be soldered in order to make contact with electrical modules, in the case of which method the structures which are intended for connection to a mother board are arranged flat on the underneath of the module (ball grid arrays). In order to produce the structures which can be soldered, solder paste pads which consist of a solder paste and cover the conductor tracks are applied onto conductor track pads and are melted by subsequently heating them so that the solder paste pads are converted by means of the surface tension of the solder into structures which can be soldered and are formed in the shape of balls to nodules. Conductor track pads with sharp-edged constructions, in conjunction with an intermediate space which surrounds them and is free of solder resist result in the liquid solder balls which are formed during the melting process reliably attaching themselves to the conductor track pads.