| 摘要 |
<p>PURPOSE: To extend the limits of interconnection of electrical and mechanical mounting by inserting board pins, which are isolated by insulation from a selected third conductive layer, into selected through-holes having I/O conversion function. CONSTITUTION: On the lower plane of a first upper laminated layer 10, which stores an integrated circuit chip 56, a lower part core, laminate layer 16 having conductive layers 18 and 20 is laminated. Then, plated through-holes 36, 38 and 40 which connect the conductive layer 20 with a conductive layer 12 on the upper plane of the upper laminated layer 10 are formed through two layers 10 and 16. In this constitution, an I/O connector is mounted by inserting pins 162 and 164, as an interface to an operating system from a module via pins 166, by selecting one of the holes from the plated through-holes 36, 38 and 40. Thus, limits in alternate connection application which requires electrical and mechanical mounting can be extended.</p> |
