Semiconductor fabrication equipment

摘要

PCT No. PCT/JP92/00136 Sec. 371 Date Oct. 27, 1992 Sec. 102(e) Date Oct. 27, 1992 PCT Filed Feb. 12, 1992 PCT Pub. No. WO92/15115 PCT Pub. Date Sep. 3, 1992.A semiconductor fabrication apparatus for forming a film on a wafer by a CVD method provides for easy removal of the dust generated in a film-forming chamber without reducing the uptime/downtime ratio of the equipment. The apparatus includes one or more gas dispersing devices having gas releasing surfaces for releasing a reaction gas to form a film on a wafer; one or more wafer holders having wafer mounting surfaces opposed to the plane defined by the gas releasing surface; and one or more cleaners, each having a suction port and a brush connected to the suction port, provided opposing the gas releasing surface. Either the cleaner or the gas dispersing device is moved so that the brush contacts and traverses the gas releasing surface.