| 摘要 |
PURPOSE: To obtain a silver-base, cadmium-free hard solder alloy which has a working temperature below a specific temperature, is easily deformable and is univerally usable by specifying the chemical composition of the hard solder. CONSTITUTION: The chemical composition of the hard solder alloy is composed of 45 to 80 wt.% silver, 5 to 13 wt.% copper, 10 to 25 wt.% gallium, 8 to 20 wt.% zinc and 0 to 5 wt.% indium and/or tin. The purpose of adding the indium and/or tin into these chemical components is to further lower the working temperature and to improve wetting characteristics. As a result, the cadmium- free hard solder alloy having the low working temperature below 630 deg.C may be obtained. |
