Wire clamping device and wire clamping method

摘要

A wire clamping device which is used to clamp bonding wire in the wire bonding of electronic components comprising: a fixed arm; a movable arm that is positioned so that the end of the fixed arm faces the and of the movable arm with a suitable gap, the movable arm being capable of bending so that the end of the movable arm approaches the end of the fixed arm; and a piezoelectric element that is attached to the movable arm which bends the movable arm by mechanical deformation of the piezoelectric device in order to clamp wire between the end of the movable arm and the end of the fixed arm. A wire clamping method for clamping bonding wire comprising bending a movable arm toward a fixed arm during wire bonding of electronic components by means of mechanical deformation of a piezoelectric element, the deformation being generated by applying a voltage to the piezoelectric element.