首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
摘要
申请公布号
JPH0629646(B2)
申请公布日期
1994.04.20
申请号
JP19870045929
申请日期
1987.02.28
申请人
HIRAKAWA TEKKOSHO
发明人
HIGUCHI NOBUO;TSUCHAMA IKUO
分类号
F22B35/00;F22B37/38;F22B37/42;(IPC1-7):F22B37/38
主分类号
F22B35/00
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Semiconductor device and method of manufacturing semiconductor device
Memory devices including two-dimensional material, methods of manufacturing the same, and methods of operating the same
Thin film capacitors embedded in polymer dielectric
Organic light-emitting display apparatus
Organic light emitting diode display device and method of fabricating the same
Embedded memory and methods of forming the same
Noise cancellation for a magnetically coupled communication link utilizing a lead frame
Doubled substrate multi-junction light emitting diode array structure
Front side copper post joint structure for temporary bond in TSV application
Microbump and sacrificial pad pattern
Semiconductor device with reduced via resistance
Chip having a pillar electrode offset from the bonding pad
Method of forming a complementary metal-oxide-semiconductor (CMOS) device
Method for mechanical stress enhancement in semiconductor devices
充电头(伊娃)
刹车盘(1)
便携式移动电源(PB-MS070)
前下角板
折叠电瓶车
储物盒(ATS)