Film segment having integrated circuit chip bonded thereto and fixture therefor.

摘要

A film segment (10) has a flexible beam lead frame formed thereon, to which an IC chip (24) is adapted to be bound in a wireless manner. The film segment having a rectangular shape is provided with at least two positioning perforations (26) formed therein, each of which is adapted to receive and fit a positioning pin element, the positioning perforations (26) being located along one of the diagonal lines of said film segment (10) and in the vicinity of said flexible beam lead frame. The fixture is held by a fixture having a window (34) encompassing the positioning perforations. The film segment can be positioned for testing the IC chip (24) at a given test position with respect to the fixture by inserting the positioning pin elements into the positioning perforations (26) through said window.