| 摘要 |
A semiconductor package is described which has external connection points (pins, pads, etc.) which may be configured from outside of the package. In one embodiment, this is accomplished with programming holes which pass through and form contact surfaces with various conductors within the package. Conductive material is then deposited into selected holes, forming connections between all of the contact surfaces in any hole. In another embodiment, configurability is accomplished via conductive pads disposed on the exterior surface of the package. Conductive jumpers are then used to connect selected pads. An auxiliary externally effected power plane and bus-bar structure are also described. |
