| 摘要 |
PURPOSE:To easily protect a cleavage plane at the outer circumference of a wafer by a method wherein cleavage planes of two semiconductor substrates are brought into close contact with each other and the substrates are pasted on a polishing plate and polished. CONSTITUTION:Cleavage planes 4 of two circular wafers 1a are brought into close contact with each other; the wafers are pasted on a polishing plate and polished. Two-inch wafers are used as the circular wafers 1a. In this state, the wafers are polished by 70mum by means of a lapping operation and by 30mum by means of a polishing, operation. Thereby, the cleavage planes 4 are protected easily and the cleavage planes 4 situated at outer circumferences of the wafers 1a can he protected easily. |
