| 摘要 |
PURPOSE:To manufacture, at high yield, a light-emitting diode array whose quality characteristic is excellent by a method wherein it is prevented that a metal film on a light-emitting part is damaged by chippings produced in a dicing operation. CONSTITUTION:A light-emitting element 21 wherein a plurality of light-emitting parts 13 are arranged in parallel with a dicing line 16 and electrode pad parts 15 corresponding to the individual light-emitting parts 13 are formed on one side in the arrangement direction of the light-emitting parts 13 is formed on an epitaxial wafer 10. A sacrifice metal film 20 is formed, in parallel with the dicing line 16, between the arrangement direction of the light-emitting parts 13 and the dicing line 16. The sacrifice metal film 20 can be formed to be T-shaped in such a way that metal films 17 on the light-emitting parts 13 are extended and that their tip parts are made parallel with the dicing line 16. |
