| 摘要 |
<p>PURPOSE:To smoothly manufacture a semiconductor device using a ceramic package such as CERDIP without generating misregistration of a lead terminal, etc. CONSTITUTION:A lead terminal 3 is fixed to a substrate 1 by an active metal brazing material 7 which contains Cu, Sn and Ag-Cu-Ti alloy as a metallic material. A semiconductor chip 4 is mounted on the substrate 1 and connected to the lead terminal 3 through a bonding wire 6. A semiconductor chip 4 and a bonding wire 6 are sealed by mounting a lid body 5 on the substrate 1 by a low melting point glass 8 and a semiconductor device (w) is acquired.</p> |
