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发明名称
PACKAGE FOR SEMICONDUCTOR CHIP
摘要
申请公布号
JPH05226516(A)
申请公布日期
1993.09.03
申请号
JP19920029843
申请日期
1992.02.18
申请人
NEC CORP
发明人
KUROKAWA YASUHIRO
分类号
H01L23/12;H01L23/15
主分类号
H01L23/12
代理机构
代理人
主权项
地址
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