SURFACE PROCESSING AND APPARATUS THEREOF

摘要

PURPOSE:To improve the processing efficiency by a method wherein an expected processing time in a processing vessel is calculated at specified time before processing to perform specified control of the processing solution corresponding to the expected processing time. CONSTITUTION:A wafer surface cleaning processor 1 is equipped with a processing vessel line 2 consisting of processing tanks P1, W1, P2...W4 while a drier D is arranged on the final stage of the line 2. A sequencer 22 is connected to an electromagnetic valve and a temperature controller 24 applicable to replacement and supply of processing solution in the processing vessel. A data controller 21 calculates the expected arrival times of cassettes 6 at each processing vessel when the cassettes 6 are successively immersed in the processing vessel to replace or supply the processing solution in accordance with the expected arrival times.