| 摘要 |
<p>PURPOSE:To obtain a liquid resist ink developable with a dilute aqueous alkali solution and suited for the production of a printed wiring board by mixing a specified ultraviolet-curable resin with a photopolymerization initiator, a diluent and a thermosetting epoxy compound. CONSTITUTION:The title composition comprises an ultraviolet-curable resin obtained by reacting a reaction product of an epoxy resin with an unsaturated monocarboxylic acid with an isocyanate compound containing at least two isocyanate groups in the molecule and a saturated or unsaturated polybasic acid anhydride, a photopolymerization initiator, a diluent and a thermosetting epoxy compound. A desirable epoxy resin is a tris(hydroxyphenyl)methane-based polyepoxy resin of formula I or II. This composition is excellent in resolution, solvent resistance and electrical properties such as plating resistance, also in adhesion to substrate, heat resistance and electrolytic corrosion resistance, and further in film properties after precuring, and can easily be subjected to contact exposure.</p> |
