Electronic switch assembly

摘要

A piezoelectric switch assembly and method of manufacture. A piezoelectric module is provided which is comprised of a carrier disk and a wafer of piezoelectric material disposed thereon, with electrical leads connected thereto. The piezoelectric module is disposed inside a hollow recess formed in a switch plug, with the periphery of the carrier disk supported on a rim thereof. A disk of compressible material is disposed between the body of the plug and the piezoelectric module. The switch plug is inserted into a hollow chamber formed in a switch insert, said switch insert having a pressure receiving front wall. A front member is provided which is formed with an aperture for receiving the switch insert. Pressure on the pressure receiving front wall of the socket causes deformation of the piezoelectric wafer to generate an electrical signal which is received by circuitry attached to the electrical leads to effect one or more preselected switch functions.