| 摘要 |
<p>PURPOSE:To improve the positional accuracy of a contact hole and to prevent the contact hole from allowing dirt to remain in it by forming a resin thin film on a contact part to form the contact hole. CONSTITUTION:An IC module 11 is constituted in a state that an insulating thin film 12 consisting of transparent insulating resin is formed on a contact pattern 32c and the contact hole 13 is accurately formed on an ISO standard position on respective contact pattern 32c. Since the thin film 12 is transparent resin, the pattern 32c can be observed even after forming the film 12. Consequently, the positioning accuracy of the contact hole 13 can be improved and the hole 13 can be prevented from allowing dirt to remain in it.</p> |
