Dip-soldering appts. with riser shaft - maintains constant height of solder while main portion of soldeoverflows back into container,申请号DE19904028082-传众专利搜索

发明名称	Dip-soldering appts. with riser shaft - maintains constant height of solder while main portion of soldeoverflows back into container
摘要	Dip soldering apparatus in which the riser shaft (7) through which solder (3) from the main container (1) is pumped into the soldering bath (5) via feed openings (14) is designed so that only a part of the solder is fed into the bath (5) while the larger portion overflows (12) back into the container. USE/ADVANTAGE - Soldering small electric components to support plates. Level changes in the soldering bath are kept to a minimum and remain such that the overflow level Delta h2 is constant during soldering.
申请公布号	DE4028082(A1)	申请公布日期	1992.03.12
申请号	DE19904028082	申请日期	1990.09.05
申请人	ROBERT BOSCH GMBH, 7000 STUTTGART, DE	发明人	FESSMAIER, JOHANN, 8430 NEUMARKT, DE;KERNSTOCK, HELMUT, 8801 LEUTERSHAUSEN, DE;HOLZER, WALTER, DIPL.-ING. (FH);GALLIWODA, KARL, 8806 NEUENDETTELSAU, DE;DANTONELLO, JOHANN, DIPL.-ING. (FH), 8827 HANNDORF, DE
分类号	B23K3/06	主分类号	B23K3/06
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