POLYIMIDE

摘要

POLYIMIDE Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability. The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives. The polyimide has recurring units of the following formula (I): (1) wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simulatineously at meta- or para-position to ether linkage The polyimide of this invention is prepared by reacting 4,4'-(p-phenylenedioxy)diphthalic dianhydride with an ether diamine having the following general formula (V): (V) and successively imidizing the resultant polyamic acid. Examples of the ether diamine used for preparing the polyamide include, 2,2-bis¢4-(3-aminophenoxy)phellyl!propane, 2,2-bis¢4-(4-aminophenoxy)phenyl!propane, 2,2-bis¢4-(3-aminophenoxy)phenyl!-1,1,1,3,3,3-hexafluoropropane, 2,2-bis¢4-(4-aminophenoxy)phenyl!-1,1,1,3,3,3-hexafluoropropane, 4,4'-bis(3-aminophenoxy)biphenyl, 4,4'-bis(4-aminophenoxy)biphenyl, bis¢4-(3-aminophenoxy)phenyl! ketone, bis¢4-(4-aminophenoxy)phenyl! ketone, bis¢4-(3-aminophenoxy)phenyl! sulfide, bis¢4-(4-aminophenoxy)phenyl! sulfide, bis¢4-(3-aminophenoxy)phenyl! sulfone and bis¢4-(4-aminophenoxy)phenyl! sulfone. BACKGROUND OF THE INVENTION The present invention relates to a novel polyimide and more particularly to the polyimide which is almost colorless, capable of being extrusion or injection molded and is furthermore excellent as high-temperature adhesive. Conventional polyimide obtained by the reaction of tetracarboxylic dianhydride with diamine has excellent electrical and mechanical properties in addition to its good high-temperature stability. Therefore the polyimide has been used in many fields such as electric and electronic members, space and aeronautic materials and