| 摘要 |
<p>PURPOSE:To reliably and accurately divide a wafer by mounting an ultrasonic oscillator adapted to supply ultrasonic energy on the upper part of a cutter body having a scribing tip at its top end. CONSTITUTION:A diamond cutter 1 consists of a cutter body 2a and a diamond tip 2b provided at the top end of the cutter body, and the upper part of the diamond cutter 1 is coupled to an ultrasonic oscillator 3a via an ultrasonic matching means 3b. That is, a scribe line is drawn on a semiconductor wafer 4 while applying ultrasonic energy to the tip 2b at the end part of the diamond cutter 1. Accordingly, since both of a mechanical strain due to a load W applied on the diamond cutter 1 and a strain due to the ultrasonic energy are applied to the semiconductor wafer 4, a strain is reliably applied into the semiconductor wafer 4 along the scribe line. By this method, the wafer can be reliably divided into individual chips 4a along the scribe line.</p> |
