| 摘要 |
PURPOSE: To improve cooling efficiency and at the same time simplify the structure of a lead for supporting a chip by forming a drawing lead, that is used for a purpose other than for drawing an electrical signal from an inner lead for common use integrated with the inner lead. CONSTITUTION: A large number of inner leads 3A1 for signal and two inner leads 3A2 for common use are provided in a lead frame. Also, a lead 3A21 for supporting a chip for adhering and fixing the main surface of a semiconductor chip is provided at a specific position of the lead 3A2 . In this manner, by adhering and fixing the main surface of the semiconductor chip by the lead 3A21 , the semiconductor chip is fixed firmly, so that the reliability and moisture resistance of a semiconductor device are enhanced. Also, a dummy lead 3C is provided at a position that corresponds to the center part of a short side, in a rectangular shape of the semiconductor chip of the lead 3A2 . The lead 3C is formed in one piece with the lead 3A2 , thus efficiently radiating heat of a heat generating part to the outside. |
