| 摘要 |
Disclosed is apparatus for mounting an electronic device package on a printed circuit board or the like. The apparatus includes a frame for receiving the electronic device package with the leads of the electronic device package presented for solderable connection to preformed locations on the printed circuit board. Solderable means are provided to mount the frame and the electronic device package on the printed circuit board. A clip engaging a heat sink is secured to the frame to urge the heat sink into intimate thermal contact with the electronic device package.
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