Plasma treating conductor plates for electronic elements - with process gas e.g. oxygen, hydrogen, fluoro-(chloro)-hydrocarbon, etc. before soldering

摘要

A process for handling flat components, esp. conductor plates with electronic elements, includes soldering the components together in a soldering machine. The conductor plates are subjected to a plasma pretreatment using a process gas, before soldering takes place. The process gas in pref. O2, H2, Cl2, N2O, N2, Ar, fluorohydrocarbons or chlorinated fluoro-hydrocarbon. ADVANTAGE - The process is simple and economical, and suffers from only minimal flux residue.