| 摘要 |
PURPOSE:To obtain a semiconductor element package whose surface is smooth, whose dimensional accuracy of an outer shape is high and whose moistureproof property is excellent by a method wherein one part of a metal ring-shaped body is buried in a resin-molded body at a periphery of a semiconductor-element mounting part and an airtight lid material is bonded to the surface of the metal ring-shaped body. CONSTITUTION:A periphery of a part, where a semiconductor element is to be installed, of a substrate 1 provided with many pins 5 for wiring use and with a wiring foil 6 is covered with a resinmolded body 7 by a metal-mold molding operation. In this case, it is constituted that the rear of the substrate 1 is covered with the resin molded body 7. Simultaneously with a resin molding operation, one face of a metal ring-shaped body 8 is buried; then, a semiconductor element 9 is installed on the substrate; the wiring foil 6 and the semiconductor element 9 are connected by using a wire 10 such as a gold wire, an aluminum wire or the like; an airtight lid material 11 is bonded to the surface of the metal ring-shaped body 8. Thereby, since a circuit of the substrate is covered with the resin-molded body by the metal- mold molding operation, the outside of a package is smooth, its dimensional accuracy is high and its moistureproof reliability of the circuit is high. In addition, since the semiconductor element 9 is sealed hermetically without being affected by the metal-mold molding operation, the semiconductor element is not damaged and its reliability is high. |
