Epoxy resin composition and multilayer printed wiring board having insulating layer formed therefrom.

摘要

A thermosetting resin composition suitable for forming an insulating layer to be interposed between two adjacent wiring patterns of a multilayer printed wiring board is disclosed which includes a bisphenol AD epoxy resin, an aromatic polyamine, mica having an average particle size of 50 mu m or less, and silica having an average particle size of 20 mu m or less, the average particle size of the silica being smaller than that of the mica, and the amount of the silica being 20-80 % based on the total weight of the silica and the mica.