首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
STRUCTURE UTILIZING DISCHARGED HEAT OF SUBWAY
摘要
申请公布号
JPH02223775(A)
申请公布日期
1990.09.06
申请号
JP19890045658
申请日期
1989.02.27
申请人
HITACHI PLANT ENG & CONSTR CO LTD
发明人
FUKUTAKE HIDEO;FUKUDA TOSHIHIRO;MAEDA SOTOMASA
分类号
F25B27/02
主分类号
F25B27/02
代理机构
代理人
主权项
地址
您可能感兴趣的专利
BOOSTER WITH SEPARATED POWER SUPPLY
SEMICONDUCTOR INTEGRATED CIRCUIT
OPTICAL COMMUNICATION SIGNAL RECEIVER
THERMALLY CONDUCTIVE SHEET FOR SHIELDING ELECTROMAGNETIC WAVE
COOLER FOR ELECTRONIC PART TESTER
TIMING SIGNAL GENERATION CIRCUIT
ELECTRONIC EQUIPMENT
MANUFACTURING METHOD FOR PRINTED BOARD
REPAIRING DEVICE FOR CIRCUIT BOARD OR THE LIKE
METHOD AND DEVICE FOR SOLDERING ELECTRONIC PART
POWER FIELD-EFFECT TRANSISTOR AND ITS MANUFACTURING METHOD
FERROELECTRIC MEMORY DEVICE
COMPOSITE MATERIAL
SEMICONDUCTOR DEVICE
HARD MACRO CELL AND METHOD OF ITS ARRANGEMENT
METHOD FOR CALCULATING DELAY TIME OF INTEGRATED CIRCUIT
DEVICE LAYOUT STRUCTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE, AND METHOD AND SYSTEM OF ELECTROPLATING
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD