Thermosetting resin composition.

摘要

A thermosetting resin composition useful for heat-resistant adhesive agents and cured shaped articles, comprising (A) a terminal imide oligomer having hydroxyl groups prepared, in an organic medium, from a biphenyltetracarboxylic acid ingredient, an aromatic diamine ingredient and a modifying monoamine ingredient having at least one hydroxy group, and exhibiting a logarithmic viscosity number of 0.01 to 1 at 30 DEG C, and (B) an organic compound having at least two epoxy groups, the imide oligomer optionally being in the state of a partial reaction product of the above-mentioned ingredients.