| 摘要 |
Structure for cooling heat-generating components such as integrated circuits 1 connected to a plugboard 3 by wires 5. The cold plate 4 in which the heat is dissipated, which is connected by plugs 2 to the components 1, is furnished with holes into which the plugs 2 penetrate partially and which are filled with a heat-transmitting compound. The risk of exerting excessive forces on the fragile wires 5 when pressing the cold plate 4 against the board 3 is thereby eliminated. <IMAGE>
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