发明名称 LAMINATE FOR HIGH FREQUENCY
摘要 <p>PURPOSE:To improve high frequency performance by keeping resin composition, which contains polyphenylene oxide, crosslinkable polymer and/or conomer, and crosslinkable prepolymer, at a specific temperature so as to make it into a compact or impregnate a substrate with it, and next doing primary formation and secondary formation. CONSTITUTION:Resin composition which contains polyphenylene oxide, crosslinkable polymer and/or monomer, and crosslinkable prepolymer is kept above 40 deg.C so as to make it into a compact or impregnate a base material with it. The polyphenylene oxide is relatively high in glass transition point and is thermosetting resin with low permittivity and with low dielectric loss factor. The resin composition containing the polyphenylene oxide is made to contain the crosslinkable polymer and/or monomer excellent in high frequency performance. And primary formation is done at a temperature that the resin component becomes the fused condition, that is, at 70-140 deg.C. Next, to completely harden it, secondary formation is done at 170-190 deg.C. And it is to be desired that this primary formation should by done for 10-40 minutes and the secondary formation for 60-120 minutes. Hereby, the contraction during hardening is small and the internal stress lowers, therefore the interlayer bonding force of a laminate and the metallic foil adhesive strength improve.</p>
申请公布号 JPH0258391(A) 申请公布日期 1990.02.27
申请号 JP19880210064 申请日期 1988.08.24
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 HEIUCHI TAKAHIRO;SAKAMOTO TAKAAKI;ITO MUNEHIKO;MAEDA SHUJI;KOSEKI TAKAYOSHI
分类号 B32B15/08;B32B37/00;C08J5/24;C08L25/04;C08L71/00;C08L71/12;H05K1/03;H05K3/00 主分类号 B32B15/08
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