| 摘要 |
<p>PURPOSE: To provide a good bond with no space by making a lead wire contact appropriately to an electric bump for forming a shared area. CONSTITUTION: On an automated bonding tape 10, plural internal lead wires 14 connected to an integrated circuit die 16 having a semiconductor active circuit is provided, and a coating film which has a characteristics suitable for wavelength of laser 15, with a melting point lower than the lead wire 14 and a bump 18, is formed to the lead wire 14. Then above the integrated circuit die 16, in the state where the tape 10 is positioned, the bump 18 and the lead wire 14 are aligned, and using the laser 15 such as pulse YAG laser, the lead wire 14 and the contact point 18 are bonded at a shared area. Thus, a good bond with no space is obtained.</p> |
