| 摘要 |
<p>PURPOSE: To enhance rigidity by applying an insulation layer to a panel only at a required part of a wiring board where a conductor pattern is formed thereby enhancing adhesion between the wiring board and a metallic panel and making the panel as thick as possible. CONSTITUTION: A metallic guard frame 3 is bonded, to the opposite face parts thereof, with a stainless steel front panel 1 and a back panel 2 by welding to form the basic body 1 of a card. A wiring board 5 is provided with an insulation layer by applying resist only to a required part where a conductor pattern is formed and the parts where a conductor pattern is not formed represent regions 6a, 6b applied with no insulation layer. Since regions 6a, 6b applied with no insulation layer are provided on the wiring board 5, adhesion between the wiring board 5 and the front panel 1 through adhesive is enhanced. Since the wiring board 5 can be made thinner by the regions 6a, 6b applied with no insulation layer, the front panel 1 can be made thicker correspondingly and the rigidity of a multifunction IC card can be enhanced.</p> |
