| 摘要 |
PURPOSE:To prevent an undesirable oxidation from occurring on the surfaces of semiconductor wafers when the semiconductor wafers are taken out or inserted from or in an reaction tube by a method wherein heating sources are designed movally along the axis of the reaction tube. CONSTITUTION:Heaters 4 are designed movally along the axis of a reaction tube 3 and 4' shows the heater subsequent to move ment. By separating the heaters 4 from the tube 3, the interior of the tube 3 can be quenched. Accordingly, as a boat 2 can be inserted in a state that the tube 3 is cooled, semiconductor wafers 1 are never oxidized reluctantly with oxygen in the air. Moreover, even when a cap is opened and the boat 2 mounted with the wafers 1 is taken out of the interior of the tube 3, the taking-out is performed in a state that the heaters 4 are separated from the tube 3. Thereby, the surfaces of the wafers are never oxidized undesirably with oxygen in the air to come into when the cap is opened.
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