| 摘要 |
PURPOSE:To improve the operability, to facilitate the mounting and to enhance the reliability of a semiconductor device by integrally forming a pattern with a bump for a damp bonding to the end of the inner leads of a lead frame. CONSTITUTION:A slitlike escape window 14 is formed by pressing at a position near the outer lead 10 of a lead frame and the end 12 of an inner lead forming section. The end 12 is formed thin by coining. Then, the inner lead 18 of the frame and a pattern 20 with a bump are formed by etching. The pattern 20 is formed by removing by etching the part 22 designated by shade from the section 16 formed in a thin plate shape, and a protrusion (bump) 20a is formed at the end. Thus, the bump 20a of the pattern 20 formed integrally at the end of the inner lead is gold-plated, and connected directly to the bonding pad of a chip. Thus, the reliability of bonding can be enhanced corresponding to the reduction in the connecting positions.
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