| 摘要 |
PURPOSE:To simplify connection, to obtain high reliability though workhours are shortened and to thin a semiconductor device by connecting a bonding-pad for an IC chip and an electrode for a wiring substrate through a conductive projecting body having elasticity. CONSTITUTION:Conductive projecting bodies (rubber bumps) 10 are formed in such a manner that conductive ink containing a conductive rubber composition is applied onto the surface of an IC chip 1, in which bonding-pads are shaped, a mask plate consisting of a metallic plate with the same opening sections as the arrangement of the bonding-pads is positioned and superposed to the bonding-pads on the IC chip 1, and the opening sections for the mask plate are spot heated by a xenon lamp, etc., or spot-irradiated with ultraviolet rays to cure conductive ink layers facing the opening sections. An uncured ink layer in a section not brought into contact with the bonding-pads is dissolved and removed by using a solvent. Rubber bumps for the IC chip are pressure- welded with electrodes 5 for a wiring substrate 4 as a copper-clad cloth base- material epoxy resin laminated board, to which a circuit is shaped, and the whole is sealed with an ultraviolet curing type epoxy resin 11. |
