| 摘要 |
<p>A wire-clamp arrangement for a machine for fastening connecting wires to the attachment points of a semiconductor component and of the housing accommodating the semiconductor component is specified. The arrangement has a movable clamping jaw which is pressed by a spring against a fixed clamping jaw and can be released from the latter under the action of an electric drive. The electric drive contains at least one piezoelectric element. The arrangement permits an increase in the response speed. <IMAGE></p> |
