发明名称 ELECTROPLATING DEVICE
摘要 PURPOSE:To maintain good electrical contact between a substrate and cathode needles by increasing the number of the cathode needles, and using springs to a cap part for retaining the substrate so that the circular substrate pressing part attached to the cap part presses the periphery of the substrate with a uniform pressure by the elasticity of the springs. CONSTITUTION:This device is constituted of a cup part 1 which allows a plating liquid to overflow from the port in the upper part, the cathode needles 4 which support the circular substrate in the position where the circular substrate contacts the surface of the plating liquid overflowing from the port of the cup part 1 and makes point contact with the circular substrate at >=3 points so as to use the circular substrate as a cathode electrode, an anode electrode which is disposed in the plating liquid without contact with the cathode part and the cap part 9 which presses the rear surface of the circular substrate with elasticity to pinch and fix the same between the cathode needles 4 to promote the electrical contact between the circular substrate and the cathode needles 4 and has holes 9a to blow gaseous nitrogen to the rear of the plating liquid.
申请公布号 JPS62182296(A) 申请公布日期 1987.08.10
申请号 JP19860022905 申请日期 1986.02.06
申请人 MITSUBISHI ELECTRIC CORP 发明人 OZAKI KATSUYA;AONO KOJI
分类号 C25D5/08;C25D7/12 主分类号 C25D5/08
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