| 摘要 |
PURPOSE:The titled composition suitable for multilayer printed circuit board, having improved flame retardance, heat resistance, etc., comprising a prepolymer consisting of a specific poly(p-hydroxystyrene)derivative and a specific epoxy modified polybutadiene as essential components. CONSTITUTION:(a) A prepolymer consisting of a poly(p-hydroxystyrene)derivative shown by formula I (A is H, alkyl, etc.; R is 2-4C alkenyl, etc.; m is 1-4; n is 1-100) is blended with (b) an epoxy modified polybutadiene shown by formula II (B is polymer of glycidyl ether epoxy; C is polybutadiene low polymer containing double bond at side chain and 0-10 hydroxyl groups bonded to main carbon chain, having 300-5,000 molecular weight in a weight ratio of 90:10-10:90, preferably 70:30-30:70 and dissolved in an organic solvent to prepare varnish. A radical polymerization initiator (epoxy curing agent) is added to the varnish to give an impregnating varnish, which is impregnated into a substrate, which is dried to give prepreg, which is laminated and bonded.
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