发明名称 DETECTING METHOD FOR END POINT OF ETCHING
摘要 PURPOSE:To detect surely the end point of an etching, by employing the emission intensity of AlCl with a specified wavelength in the case where aluminum or aluminum alloy is subjected to etching with SiCl4. CONSTITUTION:The wavelength of a monochrometer 2 is set as 261.4nm which is an emission wavelength of AlCl, SiCl4 gas is introduced into an etching chamber 1, and a high frequency voltage is applied between electrodes 8 and 7 to make the gas plasma, whereby aluminum or aluminum alloy of a sample 9 is subjected to etching. By investigating the emission intensity variation of AlCl whose wavelength is 261.4nm, the difference of emission intensity between the state in which an etching is progressing and the end point of the etching is recognized clearly, so that the end point of the etching can be surely detected.
申请公布号 JPS62122220(A) 申请公布日期 1987.06.03
申请号 JP19850261236 申请日期 1985.11.22
申请人 HITACHI LTD;HITACHI TECHNO ENG CO LTD 发明人 NAKANO TADAMASA;OKADA TAKEO
分类号 H01L21/302;H01L21/3065 主分类号 H01L21/302
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