| 摘要 |
Two-pack adhesive systems which are curable by free radical polymerization at room temperatures are disclosed. The adhesives bond a variety of substrates, including metals and plastics. The adhesives comprise a first part containing free radical polymerizable unsaturated monomer and free radical source and a second part comprising free radical polymerizable unsaturated monomer and an activator compound for the free radical source. The activator compound is a bicyclic amidine, with 1,8-diaza-bicyclo [5.4.0] undec-7-ene being especially preferred. The use of cupric salts enhances polymerization rate. |
