| 摘要 |
PURPOSE:To provide the titled adhesive applicable easily to the objective part at a desired amount to enable the correct mounting of a pellet and suitable for the mounting of a pellet to a semiconductor device, by encapsulating an adhesive component in microcapsules. CONSTITUTION:The objective adhesive can be produced by encapsulating a nearly constant amount of an adhesive component (e.g. epoxy resin, polyimide resin, silver powder, etc.) with a film-forming material in the form of microcapsules. The adhesive component is preferably added further with a filler such as copper powder. |
