首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
APPARATUS FOR APPLYING COATING ON ARTICLES
摘要
申请公布号
SU1232291(A1)
申请公布日期
1986.05.23
申请号
SU19843721117
申请日期
1984.04.05
申请人
LE PROIZV PROIZVODSTVENNO-TEKHNICHESKOGO PREDPRIYATIYA "TSENTROENERGOCHERMET"
发明人
TERENTEV VALENTIN S,SU;NIKOLAEV VALENTIN M,SU;KISTERSKIJ OLEG M,SU;KOMPANEETS VITALIJ V,SU;DESYATOV YURIJ P,SU;MULYUKIN VIKTOR V,SU;PEDAN IPPOLIT F,SU
分类号
B05C3/10;(IPC1-7):B05C3/10
主分类号
B05C3/10
代理机构
代理人
主权项
地址
您可能感兴趣的专利
CMOS-BASED THERMOPILE WITH REDUCED THERMAL CONDUCTANCE
SOLID-STATE IMAGE PICKUP UNIT AND ELECTRONIC APPARATUS
SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS
ARRAY SUBSTRATE WIRING AND THE MANUFACTURING AND REPAIRING METHOD THEREOF
SEMICONDUCTOR DEVICE HAVING JUNCTIONLESS VERTICAL GATE TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
GATE STRUCTURES FOR CMOS BASED INTEGRATED CIRCUIT PRODUCTS
CAPACITIVE DEVICE
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
PLANAR METROLOGY PAD ADJACENT A SET OF FINS IN A FIN FIELD EFFECT TRANSISTOR DEVICE
Structure for Isolating High Speed Digital Signals in a High Density Grid Array
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
CHIP ON FILM AND DISPLAY APPARATUS
SUBSTRATE FOR SEMICONDUCTOR PACKAGING AND METHOD OF FORMING SAME
INTERPOSER FABRICATING PROCESS AND WAFER PACKAGING STRUCTURE
CONVERTER HAVING PARTIALLY THINNED LEADFRAME WITH STACKED CHIPS AND INTERPOSER, FREE OF WIRES AND CLIPS
Semiconductor Package with Integrated Heat Spreader
OVER-MOLD PACKAGING FOR WIDE BAND-GAP SEMICONDUCTOR DEVICES
TSV WAFER WITH IMPROVED FRACTURE STRENGTH
Protecting Hidden Content In Integrated Circuits