| 摘要 |
There is provided a curable silicone composition, comprising: (a) from 75 to 100 mole percent chemically combined siloxy units having the formula R3SiO0.5, RSiO1.5 and SiO2; and (b) from 0 to 25 mole percent R2SiO units, there being present a number of R units having the general formula: <IMAGE> effective for curing said silicone resin upon exposure to ultraviolet radiation in the presence of a photoinitiator or upon heating in the presence of a free radical type catalyst.
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