发明名称 HEAT DISSIPATING SUBSTRATE
摘要 PURPOSE:To improve heat resistance, heat dissipation properties and electrical insulating properties by using one of a granular metal or carbon or carbide as a nucleus, employing a material, in which the surface of the nucleus is coated with a metallic oxide, as an aggregate and using a material having the same quality as a coating as filler. CONSTITUTION:The fine particles having 5-100mum grain size of a metal or carbon or a carbide having excellent thermal conductivity are used as nuclei 1, and the peripheries of the nuclei 1 are coated with a metallic oxide or soda glass anhydride having excellent electrical insulating properties, thus manufacturing aggregates 3 in which the surfaces of the nuclei 1 are coated with coating layers 2. Fillers 4 consisting of the same substance as the layers 2, the aggregates 3 and a binder are kneaded, and pressed, thus forming a substrate A by a hot press.
申请公布号 JPS60202945(A) 申请公布日期 1985.10.14
申请号 JP19840060365 申请日期 1984.03.28
申请人 SHOWA DENKO KK 发明人 SHIYOUJI TAKASHI
分类号 H01L21/52;H01L21/58;H01L23/14;H01L23/15;H01L23/373;(IPC1-7):H01L21/58 主分类号 H01L21/52
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