发明名称 Thermal development type diazo copying material with hydrophobic resin encapsulated coupler particle
摘要 A thermal development type diazo copying material comprising a support material and a photosensitive layer formed on the support material, which photosensitive layer comprises a diazo compound, a coupling component and a thermo-fusible auxiliary coloring agent, and which coupling component is capsulated by a hydrophobic polymeric material with a softening point ranging from 50 DEG C. to 150 DEG C. selected from the group consisting of hydrophobic polyester resins, hydrophobic cellulose resins, hydrophobic polyamide resins and hydrophobic polyurethane resins.
申请公布号 US4497887(A) 申请公布日期 1985.02.05
申请号 US19820384308 申请日期 1982.06.02
申请人 RICOH KK 发明人 WATANABE, NOBUYOSHI;MATSUDA, TSUTOMU
分类号 G03C1/52;G03C1/60;(IPC1-7):G03C1/60;G03C1/58 主分类号 G03C1/52
代理机构 代理人
主权项
地址