| 摘要 |
PURPOSE:To form an Ni plated film having a high cathode current density and an excellent surface characteristic at a high temp. at a high speed by adding and incorporating a specific compd. and polyoxy alkylene to and in a copper plating bath consisting essentially of copper sulfate. CONSTITUTION:The compd. such as sodium propagyl sulfonate, etc. expressed by the general formula (1) at a rate of 0.1-10g/l, the polyoxyalkylene expressed by the general formula (2) at 0.01-10g/l or further the compd. such as sodium allyl sulfonate expressed by the general formula (3) at 0.1-5g/l are added to a copper plating soln. consisting of an aq. soln. composed essentially of copper sulfate and contg. a slight amt. of Cl ion. An electroplating operation is made possible at the higher temp. and current density than in the prior art, such as 15-60 deg.C temp. of the plating bath and 1.5-30A/dm<2> cathode current density, by which the Ni electroplating at a high speed with uniform gloss, surface smoothness and electrodepositing thickness is made possible.
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