| 摘要 |
PURPOSE:To enhance the junction strength by a method wherein a glass group consisting of glasses with low melting point and glasses with high melting point is formed between a ceramic base and a cap. CONSTITUTION:A semiconductor pellet is adhered to the inner base of a concave place 12 on a ceramic base 11 using wax material such as an Ag paste, etc. The base 11 and a cap 15 are joined by glasses 17a and 17b with low melting point. To the glass 17a, a lead frame 18 consisting of an inner lead 18a and an external lead 18b are adhered, and, after that, a pellet 14 and the inner lead 18a are connected by a wire 19. Glass layers 20a and 20b with high melting point are formed among the glasses 17a and 17b, the base 11 and the cap 15 in order to tightly adhere the glasses 17a and 17b, the base 11 and the cap 15 mutually. |
