发明名称 CONTROL DEVICE FOR ELECTROLESS PLATING
摘要 PURPOSE:To obtain a titled device which controls accurately the concn. of a plating soln. compsn. and changes easily the set value for control by dividing the control device into a control terminal part and a main control part, and mounting microcomputers in the respective divided parts. CONSTITUTION:The plating soln. in a plating cell is conducted to sensors S1-Sn which detect the concn. of the plating soln, compsn. in a control terminal part 2. The output values thereof are collected and accumulated at every specified time by a microcomputer CPU 2a. The values are averaged for a specified period by the request from a main control part 1, and the result thereof is sent, via a communication circuit 3, to a main computer 1a. The computer 1a makes correction calculation by a prescribed equation, to determine each concn. of the compsn., compares the same with a set value, calculates a deficient amt. if the concn. of the compsn. is not enough, and emits an instruction to the CPU 2a so as to replenish the deficient amt. The CPU 2a upon receipt of such instructions controls pump control parts SW1-SWn for replenishing the plating soln. whereby the corresponding chemical soln. is replenished to the plating soln. compsn.
申请公布号 JPS5989757(A) 申请公布日期 1984.05.24
申请号 JP19820198559 申请日期 1982.11.12
申请人 NIPPON DENKI KK 发明人 MORIZAKI GENJI;GOSHIMA TAKAO;NOGUCHI SADAO
分类号 C23C18/16;C23C18/31;C23C18/40;G05D21/00 主分类号 C23C18/16
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